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Mengdi Han Research Group

(韩梦迪课题组)

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    • HOME
    • RESEARCH 
      • OVERVIEW
      • ELECTRONIC SKINS
      • WEARABLE DEVICES
      • SMART IMPLANTS
    • GROUP 
      • CURRENT
      • ALUMNI
    • PUBLICATIONS 
      • 2026
      • 2025
      • 2024
      • 2023
      • 2022
      • 2021
      • 2020
      • 2010s
      • FULL LIST
      • COVERS
    • NEWS 
      • 2026
      • 2025
      • 2024
      • 2023
      • 2022
      • 2021
      • 2020
    • CONTACT
    • JOIN US

    Mengdi Han Research Group

    (韩梦迪课题组)

    • HOME
    • RESEARCH 
      • OVERVIEW
      • ELECTRONIC SKINS
      • WEARABLE DEVICES
      • SMART IMPLANTS
    • GROUP 
      • CURRENT
      • ALUMNI
    • PUBLICATIONS 
      • 2026
      • 2025
      • 2024
      • 2023
      • 2022
      • 2021
      • 2020
      • 2010s
      • FULL LIST
      • COVERS
    • NEWS 
      • 2026
      • 2025
      • 2024
      • 2023
      • 2022
      • 2021
      • 2020
    • CONTACT
    • JOIN US
    • …  
      • HOME
      • RESEARCH 
        • OVERVIEW
        • ELECTRONIC SKINS
        • WEARABLE DEVICES
        • SMART IMPLANTS
      • GROUP 
        • CURRENT
        • ALUMNI
      • PUBLICATIONS 
        • 2026
        • 2025
        • 2024
        • 2023
        • 2022
        • 2021
        • 2020
        • 2010s
        • FULL LIST
        • COVERS
      • NEWS 
        • 2026
        • 2025
        • 2024
        • 2023
        • 2022
        • 2021
        • 2020
      • CONTACT
      • JOIN US

      Mengdi Han Research Group

      (韩梦迪课题组)

      • Electronic Skins

        Electronic skins represent a class of soft, ultrathin, and elastic sensor arrays capable of multimodal detection. Their unique form factor enables intimate, conformal lamination onto complex curvilinear surfaces, such as humanoid robotics to minimally invasive surgical instruments. Our group pioneers MEMS-compatible electronic skins utilizing 3D architectures. These 3D geometries expand mechanical degrees of freedom, thereby enabling the precise measurement of triaxial forces and complex tactile information. We innovate manufacturing processes to construct 3D structures across various scales, and apply these devices in biomedicine and robotics.

        Representative Publications

        (3) Three-dimensional micro strain gauges as flexible, modular tactile sensors for versatile integration with micro- and macroelectronics

        C Xu¹, Y Wang¹, J Zhang, J Wan, Z Xiang, Z Nie, J Xu, X Lin, P Zhao, Y Wang, S Zhang, J Zhang, C Liu, N Xue, W Zhao, M Han*

        Science Advances 2024, 10, eadp6094.

        (2) Catheter-integrated soft multilayer electronic arrays for multiplexed sensing and actuation during cardiac surgery

        M Han¹, L Chen¹, K Aras¹, C Liang, X Chen, H Zhao, K Li, NR Faye, B Sun, W Bai, JH Kim, Q Yang, Y Ma, E Song, JM Baek, Y Lee, C Liu, JB. Model, G Yang, R Ghaffari, Y Huang*, IR. Efimov*, JA Rogers*

        Nature Biomedical Engineering 2020, 4, 997-1009. (Featured as the Cover)

        [News & Views in Nature Biomedical Engineering], [Preview in Matter]

        (1) Three-dimensional piezoelectric polymer microsystems for vibrational energy harvesting, robotic interfaces and biomedical implants

        M Han¹, H Wang¹, Y Yang, C Liang, W Bai, Z Yan, H Li, Y Xue, X Wang, B Akar, H Zhao, H Luan, J Lim, I Kandela, GA Ameer, Y Zhang*, Y Huang*, JA Rogers*

        Nature Electronics 2019, 2, 26-35. (Featured as the Cover)

        [News & Views in Nature Electronics]

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        Mengdi Han Research Group
        Mengdi Han Research Group, 韩梦迪课题组 Department of Biomedical Engineering, College of Future Technology, Peking University
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