Dr. Mengdi Han is an Assistant Professor in the Department of Biomedical Engineering, College of Future Technology, Peking University. He received his B.S. degree in Huazhong University of Science and Technology in 2012 and Ph.D. degree in Peking University in 2017. He was a visiting Ph.D. student at Department of Materials Science and Engineering, University of Illinois Urbana-Champaign from 2015 to 2017. He worked as a postdoctoral fellow at Querrey Simpson Institute for Bioelectronics, Northwestern University from 2017 to 2020. He published more than 100 SCI-indexed papers, including first/corresponding author papers in Nature Electronics, Nature Biomedical Engineering, Science Translational Medicine, Science Robotics, Science Advances, PNAS, Advanced Materials, etc. His research group focuses on the engineering of miniaturized biomechanical sensing platforms with advanced sensing capabilities. His research has been recognized with many awards including Microsystems & Nanoengineering Young Scientist Award (2020), MIT Technology Review Innovators Under 35 Asia Pacific (2021), iCANX Young Scientist Award (2024), and Asian Young Scientist Fellowship (2024).

韩梦迪，北京大学未来技术学院生物医学工程系博士生导师。2012年本科毕业于华中科技大学电子科学与技术系，2017年博士毕业于北京大学微纳电子学系；2015-2017年作为联合培养博士生就读于美国伊利诺伊大学材料科学与工程系，2017-2020年于美国西北大学Querrey Simpson生物电子研究所从事博士后研究。获基金委海优、教育部U40、重点研发计划课题、亚洲青年科学家基金等项目支持，获Microsystems & Nanoengineering青年科学家、《麻省理工科技评论》亚太区科技创新35人等奖励及荣誉。第一/通讯作者论文发表于 Nature Biomedical Engineering, Nature Electronics, Science Robotics, Science Translational Medicine, Science Advances, PNAS, Advanced Materials等期刊。韩梦迪课题组致力于研发小型化的生物力学感知平台，通过电子皮肤、可穿戴设备、智能植入物等形式，持续推动医疗健康解决方案的创新与迭代。